R&D Manager
Fraunhofer Institute IZM
Berlin, Germany
Erik Jung (ORCID: 0000-0001-6172-6532)
With a background in “physics”, “physical chemistry” and “physics in medicine” from the University of Kaiserslautern, he joined Fraunhofer IZM in 1994. Heading the group Advanced Microsystem Assembly, he developed processes in flip chip and chip embedding technologies eventually expanding his research field into the MEMS/NEMS packaging and initiated IZM´s MEMS research program in 2005.
Staying from 2007 to 2008 as a research delegate at the University of Utah he was involved in the packaging of a wireless brain computer interface, establishing the focus group on Medical Microsystems upon his return to the Fraunhofer IZM. He was appointed as head of the business sector on medical technologies in 2009.
Since 2015, he is part of IZM´s Business Development Team with a core expertise on Medical Microsystems. Since 2019, he also serves as liaison manager to Fraunhofer USA.
Erik is participating as a standing member in conference and roadmap activities of IEEE-EPS (US) and DGBMT (DE) with his expertise in advanced heterointegration.
In the industrial user interest group IVAM (DE) he has been founding member of the Wearable Electronics initiative (2014) and is acting board member in the association for Organic Electronic Saxony (OES) since 2018
As a part of the Heterogenous Integration Roadmap Task Force of IEEE-EPS, he is co-chairing the TWG on the System-in-Package activities since 2019.
His professional activities span more than 100 publications, contributions to three books and numerous invited talks in Germany, France, Norway, US and Asia. He is inventor or co-inventor in 25 patents
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Advanced Packaging & Robotics: A virtuous cycle
Wednesday, April 2, 2025
11:05am – 11:30am EDT