Advanced Packaging (AP) is a current buzzword, bearing the promise to keep -together with chiplet based architectures- Moore´s Law for the semiconductor industry on track and beyond. Robotic assisted processes will become key to the implementation of AP technology, as cleanliness, working in environmentaly controlled ambients, moving loads while maintaining extreme precision, picking and placing miniature and subminature components adjacent to very sensitive circuitry are paramount to a quality assured, high yield production. In the same context, AP will serve next generation robotic systems with improved control, inherent situation awareness and built-in artificial intelligence (AI-on-the-Edge) to fulfil the challenging requirements of industrial assembly, handling and transporting. As of this, AP is not only benefitting from the robotics innovation, but will rather play a crucial role in augmenting current robots to their next evolution. The presentation will showcase the current developments, where AP takes advantage of robotic systems and how AP will enable future robotics to fulfil their purposes as cobots, autonomous and humanform robots.
