An agile approach to Digital Transformation (DX) in back-end semiconductor manufacturing redefines how data is managed and utilized by combining data mesh principles with low/no-code platforms, enabling unparalleled flexibility and adaptability. While SECS/GEM remains a widely used standard for process tool integration, it may not fully address the evolving demands of advanced back-end processes like packaging, assembly, and testing, particularly in heterogeneous integration (HI) environments. HI processes—such as chiplet-based designs, 3D stacking, and hybrid bonding—demand real-time control, high-volume data exchange, and flexible integration of diverse systems. Emerging protocols like OPC-UA, combined with edge computing, are better suited for these challenges. These technologies enable real-time data processing, AI/ML-driven insights, and seamless communication across a broad ecosystem, from inspection tools to MES and ERP systems. With self-service tools, drag-and-drop tools domain experts, engineers and non-programmers can tailor solutions to their unique needs, integrating data from advanced packaging processes, subfab monitoring, and quality control systems. This approach ensures adaptability to changing requirements and fosters continuous improvement, higher yields, and operational efficiency—outpacing traditional, static solutions by embracing modern, AI-ready technologies and distributed data architectures.
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