Senior Product Innovation Engineering Manager
Nordson Electronics Solutions
Carlsbad, CA, United States
Alan Lewis, B.S. and M.S. Mechanical Engineering University of Missouri – Rolla (now Missouri University of Science and Technology), heads the Product Innovation Engineering team at Nordson Electronics Solutions, where he leads the development of technologies including the application of AI/ML for anomaly detection, process control, and process optimization in fluid dispensing equipment for advanced semiconductor packaging applications.
Alan embarked on his career in research as an Amoco Fellow while in graduate school, where he conducted research in advanced adaptive process control and continued his 40-year career specializing in the study, design, and development of manufacturing equipment across various industries, including automotive, medical, solar, electronics, and aerospace.
Published in peer-reviewed journals and conferences and with over 20 patents for devices and processes to his name, Alan has contributed his expertise to several organizations, including Moog Automotive, Baxter Healthcare, The Aerospace Corporation, Palo Alto Research Corporation, Solar World Innovation, and the Nordson Corporation.
Disclosure information not submitted.
Automation and AI (Machine Learning) in Backend Packaging
Tuesday, April 1, 2025
2:05pm – 2:30pm EDT