In Gordon Moore’s seminal paper, he predicted a “Day of Reckoning.” That day has arrived. While transistor shrinks still continue, their benefits in economics, speed, and effective chip size have ground to a halt. However, as was predicted, there is another path forward that doesn’t rely on ever-shrinking devices. Advanced packaging is the new path, and it is at the core of the new industry model that is Foundry 2.0.
Foundry 2.0 brings together the best of all technologies and material solutions by using the interconnect and manufacturing methods typically used in building semiconductor devices themselves. This foundry evolution, based on Advanced Packaging (AP), it is inherently a different business than today’s foundry model.
This talk will discuss the expanding AP tool box and how the new AP centric foundry model leverages application specific systems of chiplets for cost reduction and innovation.
