Advanced System Integration and Packaging provides a powerful and cost-effective means for building complex systems. Recently, sophisticated examples of modules containing nearly 50 dies, many fabricated by different vendors on different technological nodes, have been demonstrated. Advanced Packaging with its promise of decreased cost through higher manufacturing yield enabled by die size reduction, chiplet node optimization, modularity of function through chiplets reuse as well as heterogeneous integration will be an essential foundation of future systems. At the current time, 2.5D integration of many dies on a common substrate, or their complex 3D integration is challenged by many factors including (1) limited availability of general design automation platforms for package co-design, (2) computationally expensive multiscale and multiphysics models that make design exploration cumbersome, (3) inefficient power conversion and delivery, (4) increasing need for sophisticated heat removal solutions at system, module and intra-die levels, (5) novel materials characterization and metrology needs (6) process development for progression towards shrinking TSV size, solder bump pitch, direct copper bonding as well as hybrid bonding and (7) manufacturability and reliability challenges due to complex failure phenomena. In this talk, I will provide a broad overview of Advanced Packaging research at Purdue University that addresses the above challenges.
