Executive Advisor TechSearch International Austin, TX, United States
Highlight the latest advancements in chip assembly, package & test techniques, for current & future advanced nodes, mature nodes, traditional and future packaging (e.g. 2.5D, 3D, fan-out, and system-on-a-chip (SoC) etc.) approaches. Discuss how these technologies are reshaping the industry and enabling high-performance, low-power chips for applications like 5G, autonomous vehicles, and IoT
