Automotive applications are required to meet very stringent reliability objectives as called out in ISO-26262. These objectives address failure rates and functional safety of the chips. Chiplets for automotive applications will be subject to the same stringent reliability requirements. Chiplets will present more complex reliability concerns than those addressed by monolithic silicon. Addressing chiplet reliability poses unique challenges especially when chiplets sourced from multiple vendors is considered. This presentation addresses the reliability concerns of heterogeneous systems including inter-chip interconnects, thermal management, testing, yield management, and long term reliability. To achieve ISO26262 compliance including meeting ASIL reqjuirements and assuring that failures will comply with the functional safety requirements will require methods and procedures specific for heterogeneous integration.
