As wafer fabs continue to accelerate deployment of digital transformative technologies such as digital twins, data analytics, and AI, the APT area including assembly, advanced packaging, heterogeneous integration, test provided by OSATs, and EMS/ECM companies have unique challenges to overcome during their journey of digital transformation of these critical manufacturing lines. Recently published roadmaps (by NIST) show that for US back-end manufacturing to grow it will be critical for organizations to adopt Industry4.0/5.0 technologies in APT areas. This stage will focus on Smart Manufacturing for semiconductor assembly, package and test in chip production.​